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| MT3275AE资料 | |
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MT3275AE PDF Download |
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File Size : 116 KB
Manufacturer:MIT Description:If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package: Using 0.5 square inches of copper area, JA is 50˚C/W; with 1 square inch of copper area, JAis 37˚C/W; and with 1.6 or more inches of copper area, JA is 32˚C/W. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MT3275AE 厂 家：MIT 封 装：DIP 批 号：92+ 数 量：7600 说 明：绝对原装深圳现货/底价 |
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运 费： 所在地： 新旧程度： |
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| 联系人：龙先生,胡小姐 |
| 电 话：0755-83226907,83229025,83226903 |
| 手 机：13927436669 |
| QQ：1109170345,514620629 |
| MSN：hlh1999@msn.com |
| 传 真：0755-83226930 |
| EMail：sale@cdf-ic.com |
| 公司地址： 深圳市福田区中航路新亚洲电子商城国利大厦710室. |
