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MC10H101L

MC10H101L资料
MC10H101L
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File Size : 116 KB
Manufacturer:MOT
Description:  The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and   soldering should be 100C or less.* • When preheating and soldering, the temperature of the   leads and the case must not exceed the maximum   temperature ratings as shown on the data sheet. When   using infrared heating with the reflow soldering   method, the difference shall be a maximum of 10C.
 
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型 号:MC10H101L
厂 家:MOT
封 装:DIP
批 号:9223+
数 量:2
说 明:绝对现货特价
 
 
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