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M5219L

M5219L资料
M5219L
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File Size : 116 KB
Manufacturer:MIT
Description:The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra-red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
 
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型 号:M5219L
厂 家:MIT
封 装:SIP
批 号:96
数 量:700
说 明:绝对原装深圳现货/底价
 
 
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