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| CX20442-31资料 | |
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CX20442-31 PDF Download |
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File Size : 116 KB
Manufacturer:CONEXANT Description:MATERIAL: A) PACKAGE BODY & COVER : WHITE ALUMINA (92%) B) LEADS & PACKAGE BOTTOM: COPPER PLATING : ELECTROLYTIC GOLD 100 - 200 MICROINCHES OVER ELECTROLYTIC NICKEL 100 TO 200 MICROINCHES. DIMENSIONS ARE IN INCHES (MILLIMETERS). UNLESS OTHERWISE SPECIFIED TOL. ARE 0.005(0.13). ALL UNLABELED LEADS ARE GROUND. THESE LEADS ARE CONNECTED INTERNALLY TO THE PACKAGED BOTTOM GROUND. THE PACKAGE BOTTOM RF GROUND MUST BE SOLDERED TO THE PCB RF GROUND. PACKAGE LENGTH AND WIDTH DIMENSIONS SHOWN DO NOT INCLUDE LID SEAL PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.005 (0.127MM) PER SIDE. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：CX20442-31 厂 家：CONEXANT 封 装：LQFP 批 号：05/06+ 数 量：190 说 明：绝对原装正品底价 |
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运 费： 所在地： 新旧程度： |
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| 联系人：龙先生,胡小姐 |
| 电 话：0755-83226907,83229025,83226903 |
| 手 机：13927436669 |
| QQ：1109170345,514620629 |
| MSN：hlh1999@msn.com |
| 传 真：0755-83226930 |
| EMail：sale@cdf-ic.com |
| 公司地址： 深圳市福田区中航路新亚洲电子商城国利大厦710室. |
