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| BSC022N03S资料 | |
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BSC022N03S PDF Download |
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File Size : 116 KB
Manufacturer:infineon Description:Notes: 1. RJA is determined with the device mounted on a 1 in2 2 oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. The thermal resistance from the junction to the circuit board side of the solder ball, RJB, is defined for reference. For RJC, the thermal reference point for the case is defined as the top surface of the copper chip carrier. RJC and RJB are guaranteed by design while RJA is determined by the user's board design. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：BSC022N03S 厂 家：infineon 封 装：TDSON-8,8P 批 号：06+ 数 量：9056 说 明：绝对原装深圳现货/底价 |
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运 费： 所在地： 新旧程度： |
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| 联系人：龙先生,胡小姐 |
| 电 话：0755-83226907,83229025,83226903 |
| 手 机：13927436669 |
| QQ：1109170345,514620629 |
| MSN：hlh1999@msn.com |
| 传 真：0755-83226930 |
| EMail：sale@cdf-ic.com |
| 公司地址： 深圳市福田区中航路新亚洲电子商城国利大厦710室. |
