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| BCM2050KML资料 | |
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BCM2050KML PDF Download |
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File Size : 116 KB
Manufacturer:BROADCOM Description:the heat to be removed in all directions. Via holes, necessary for RF grounding, should be filled with copper plating to further remove heat from the duplexers Tx filter and dump it into a second ground plane located in a lower layer of the motherboard. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：BCM2050KML 厂 家：BROADCOM 封 装：BGA 批 号：05+ 数 量：550 说 明：绝对原装深圳现货/底价 |
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运 费： 所在地： 新旧程度： |
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| 联系人：龙先生,胡小姐 |
| 电 话：0755-83226907,83229025,83226903 |
| 手 机：13927436669 |
| QQ：1109170345,514620629 |
| MSN：hlh1999@msn.com |
| 传 真：0755-83226930 |
| EMail：sale@cdf-ic.com |
| 公司地址： 深圳市福田区中航路新亚洲电子商城国利大厦710室. |
