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| AM26LS32PC资料 | |
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AM26LS32PC PDF Download |
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File Size : 116 KB
Manufacturer:AMD Description: 260C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied dur- ing cooling * Soldering a device without preheating can cause exces- sive thermal shock and stress which can result in damage to the device. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：AM26LS32PC 厂 家：AMD 封 装：DIP16 批 号：01 数 量：725 说 明：绝对原装正品底价 |
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运 费： 所在地： 新旧程度： |
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| 联系人：龙先生,胡小姐 |
| 电 话：0755-83226907,83229025,83226903 |
| 手 机：13927436669 |
| QQ：1109170345,514620629 |
| MSN：hlh1999@msn.com |
| 传 真：0755-83226930 |
| EMail：sale@cdf-ic.com |
| 公司地址： 深圳市福田区中航路新亚洲电子商城国利大厦710室. |
