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| ACM2012-900-2P资料 | |
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ACM2012-900-2P PDF Download |
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File Size : 116 KB
Manufacturer:TDK Description:The UCSP is a unique package that greatly reduces board space compared to other packages. UCSP relia- bility is integrally linked to the users assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering using a UCSP. This form factor might not perform equally to a packaged product through traditional mechanical reliability tests. Performance through operating life test and moisture resistance remains uncompromised, as it is determined primarily by the wafer-fabrication process. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：ACM2012-900-2P 厂 家：TDK 封 装： 批 号：0712 数 量：4,000 说 明：绝对原装正品底价 |
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运 费： 所在地： 新旧程度： |
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| 联系人：龙先生,胡小姐 |
| 电 话：0755-83226907,83229025,83226903 |
| 手 机：13927436669 |
| QQ：1109170345,514620629 |
| MSN：hlh1999@msn.com |
| 传 真：0755-83226930 |
| EMail：sale@cdf-ic.com |
| 公司地址： 深圳市福田区中航路新亚洲电子商城国利大厦710室. |
