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首页 > 推广型号列表 >2SD1758

2SD1758

2SD1758资料
2SD1758
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File Size : 116 KB
Manufacturer:ROHM
Description:Note 2: The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TJMAX = 125˚C or 150˚C), the junction-to-ambient thermal resistance (JA), and the ambient temperature (TA). PDMAX = (TJMAX − TA)/JA. If this dissipation is exceeded, the die tem- perature will rise above TJMAX and the electrical specifications do not apply. If the die temperature rises above 150˚C, the device will go into thermal shutdown. For the TO-3 package (K, KC), the junction-to-ambient thermal resistance (JA) is 39˚C/W. When using a heatsink, JA is the sum of the 4˚C/W junction-to-case thermal resistance (JC) of the TO-3 package and the case-to-ambient thermal resistance of the heatsink. For the TO-220 package (T), JA is 54˚C/W and JC is 4˚C/W. If SOT-223 is used, the junction-to-ambient thermal resistance is 174˚C/W and can be reduced by a heatsink (see Applications Hints on heatsinking).
 
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型 号:2SD1758
厂 家:ROHM
封 装:TO-252
批 号:0633+
数 量:750
说 明:绝对原装深圳现货/底价
 
 
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